CSPC 2014: The 2014 International Conference on Communications, Signal Processing and Computers will take place at Interlaken, Switzerland, February 22 (Saturday), February 23 (Sunday), February 24 (Monday), 2014

CSPC'14 interlaken2014 at gmail.com
So Nov 24 13:16:06 CET 2013


                                     CSPC 2014

The 2014 International Conference on Communications, Signal Processing and Computers will take place at
Interlaken, Switzerland, February 22 (Saturday), February 23 (Sunday), February 24 (Monday), 2014
http://tinyurl.com/cspc2014

The conference proceedings will be published on hard copy and CD

The Proceedings of the Conference with all the accepted and registered papers of the conferences will be sent for indexing to: 
ISI (Thomson Reuters), ELSEVIER, SCOPUS, Zentralblatt MATH, British Library, EBSCO, SWETS, EMBASE, CAS - American Chemical Society, 
EI Compendex, Engineering Village, DoPP, GEOBASE, Biobase, TIB|UB - German National Library of Science and Technology, 
American Mathematical Society (AMS), Inspec - The IET, Ulrich's International Periodicals Directory, Scholar Google. 

As in all the Previous Conferences, extended Versions of all the accepted Papers will appear in well-known and reputable 
international scientific journals (Indexed in SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, 
EBSCO, SWETS, EMBASE, CAS, Scholar Google etc) and in SPRINGER VERLAG Books 
      Check our Previous Books in Springer via the conference web site


All the articles will undergo thorough peer review, and the names of the reviewers will be published on the conference web page, as well as the
proceedings 
(hard copy and CD). 


On our website (http://tinyurl.com/eurolib) you can already see reviewers' names from previous conferences, as well as the quality and international 
diversity of the submitted works: http://tinyurl.com/eurolib

You can download 15 proceedings volumes from 2013, along with the reviewers' names from each volume: http://tinyurl.com/eurolib

You can also browse papers without needing to download the entire volume. The acceptance rate of previous conferences 
(accepted papers over total submissions) was around 35%.

Deadlines:   Paper submission deadline:   December 15, 2013 
--------------


General Chairs (Editors of Proceedings)
--------------------------
Professor Kleanthis Psarris, 
The City University of New York, 
USA

Professor Ryszard S. Choras
Institute of Telecommunications
University of Technology & Life Sciences
Bydgoszcz, Poland

Professor Sandra Sendra
Instituto de Inv. para la Gestión Integrada de 
Zonas Costeras (IGIC)
Universidad Politécnica de Valencia
Spain

Senior Program Chair
--------------------------
Professor Maurice Margenstern, 
Université de Lorraine, 
France

Program Chairs
--------------------------
Professor Theodore B. Trafalis, 
University of Oklahoma, 
USA

Professor Claudio Talarico, 
Gonzaga University, Spokane, 
WA, USA

Professor Zhuo Li, 
Beijing University Of Technology, 
Beijing, China


Tutorials Chair
--------------------------
Professor Pradip Majumdar
Department of Mechanical Engineering
Northern Illinois University
Dekalb, Illinois, USA

Special Session Chair
--------------------------
Professor Shuliang Li, 
The University of Westminster, 
London, UK
 
Workshops Chair
--------------------------
Professor Dimitrios A. Karras, 
Sterea Hellas Institute of Technology, 
Greece

Local Organizing Chair
--------------------------
Professor Jan Awrejcewicz, 
Technical University of Lodz, 
Lodz, Poland

Publication Chair
--------------------------
Professor Vincenzo Niola
Departement of Mechanical Engineering for Energetics
University of Naples "Federico II"
Naples, Italy

Publicity Committee
--------------------------
Professor Reinhard Neck
Department of Economics
Klagenfurt University
Klagenfurt, Austria

Professor Myriam Lazard
Institut Superieur d' Ingenierie de la Conception
Saint Die, France
International Liaisons

Professor Ka-Lok Ng
Department of Bioinformatics
Asia University
Taichung, Taiwan

Professor Olga Martin
Applied Sciences Faculty
Politehnica University of Bucharest
Romania

Professor Eduardo Mario Dias
Electrical Energy and Automation
Engineering Department
Escola Politecnica da Universidade de Sao Paulo
Brazil



Steering Committee
--------------------------
Professor Aida Bulucea, University of Craiova, Romania (Chair)
Professor Zoran Bojkovic, Univ. of Belgrade, Serbia
Professor Claudio Talarico, Gonzaga University, Spokane, USA
Professor Imre Rudas, Obuda University, Budapest, Hungary

Program Committee
--------------------------
Prof. Bharat Doshi, John Hopkins University, Mayrland, USA
Prof. Gang Yao, University of Illinois at Urbana - Champaign, USA
Prof. Lu Peng, Luisian State University, Baton Rouge, LA, USA
Prof. Pavel Loskot, Swansea University, UK
Prof. Abdullah Eroglu, Indiana University & Purdue University Fort Wayne (IPFW), USA
Prof. Francesco Zirilli, Sapinenza Universitat di Roma, Rome, Italy
Prof. Yoon-Ho Choi, Samsung Electronics Co. Ltd, South Korea
Prof. Winai Jaikla, KMITL University, Bangkok, Thailand
Prof. Ki Young Kim, Samsung Advanced Institute of Technology, Korea
Prof. Stamatios Kartalopoulos, The University of Oklahoma, USA
Prof. Vyacheslav Tuzlukov, Kyungpook National University, South Korea
Prof. Stevan Berber, The University of Auckland, New Zeland
Prof. Alexander Zemliak, Autonomous University of Puebla, Mexico
Prof. Zoran Bojkovic, University of Belgrade, Serbia
Prof. Etsuji Tomita, The University of Electrocommunications, Japan
Prof. Lawrence Mazlack, University of Cincinnati, USA
Prof. Dragana Krstic, University of Nis, Serbia
Prof. Natasa Zivic, University of Siegen, Siegen, Germany
Prof. Tomas Zelinka, Czech technical University in Prague, Czech Republic
Prof. Andrzej Chydzinski, Silesian University of Technology, Gliwice, Poland
Prof. Winai Jaikla, King Mongkut's Institute of Technology Ladkrabang, Thailand
Prof. Prof. Kemal Tutuncu, Selcuk University, Konya, Turkey
Prof. Zhuo Li, Beijing University Of Technology, Beijing, China
Prof. Charles Suffel, Stevens Institute of Technology, Hoboken, NJ, USA
Prof. Shuliang Li, The University of Westminster, London, UK
Prof. Kun Chang Lee, Sungkyunkwan University, Korea
Prof. Dimitri Bertsekas,IEEE Fellow, MIT, USA
Prof. Demetri Terzopoulos, IEEE Fellow, ACM Fellow, UCLA, USA
Prof. Georgios B. Giannakis, IEEE Fellow, University of Minnesota, USA
Prof. Jun Wang, Beijing Jiaotong University, P. R. China
Prof. Josip Music, University of Split, Croatia
Prof. Gen Qi Xu, Tianjin University, Tianjin, China
Prof. Alexander Gelbukh, National Polytechnic Institute (IPN), Mexico
Prof. Charles Suffel, Stevens Institute of Technology, Hoboken, NJ, USA
Prof. Kun Chang Lee, Sungkyunkwan University, Korea
Prof. Andre A. Keller, Universite de Lille Nord de France, France
Prof. Vaclav Skala, University of West Bohemia, Czech Republic
Prof. Bimal Kumar Bose (Life Fellow IEEE), The University of Tennessee, Knoxville, USA
Prof. Wasfy B. Mikhael, IEEE Fellow, Vice President IEEE Circuits and Systems, University of Central Florida, Orlando, USA
Prof. Yuriy S. Shmaliy (IEEE Fellow), Universidad de Guanajuato, MEXICO
Prof. D. Subbaram Naidu (Fellow IEEE), Idaho State University, USA
Prof. Narsingh Deo, IEEE Fellow, ACM Fellow, AAAS Fellow, ICA Fellowm Orlando, Florida, USA
Prof. Panagiotis Agathoklis, University of Victoria, British Columbia, Canada
Prof. Imre J. Rudas, Óbuda University, Budapest, Hungary
Prof. Jiri Hrebicek, Masaryk University, Brno, Czech Republic
Prof. Brett Nener, The University of Western Australia, Australia
Prof. Branimir Reljin, University of Belgrade, Serbia
Prof. Humberto Varum, University of Aveiro, Aveiro, Portugal
Prof. Ronald Tetzlaff, Technical University Dresden, Germany
Prof. Peter Szolgay, Pazmany Peter Catholic University, Hungary
Prof. Xiang Bai, Huazhong University of Science and Technology, China
Prof. Carla Pinto, Polytechnic of Porto, Porto, Portugal
Prof. Hung-Yuan Chung, National Central University, Taiwan
Prof. Sorinel Oprisan, College of Charleston, Charleston, South Carolina, USA
Prof. Brian Barsky (IEEE Fellow, University of Berkeley, USA)
Prof. Aggelos Katsaggelos (IEEE Fellow, Northwestern University, USA)
Prof. Leonid Kazovsky (Stanford University, USA)
Prof. Anastassios Venetsanopoulos (Fellow IEEE, University of Toronto, Canada)
Prof. Steven Collicott (Purdue University, West Lafayette, IN, USA)
Prof. Nikolaos G. Bourbakis (IEEE Fellow, Wright State University, USA)
Prof. Hashem Akbari (University of California, Berkeley, USA)
Prof. Lei Xu (IEEE Fellow, Chinese University of Hong Kong, Hong Kong)
Prof. Patrick Wang (MIT, USA)
Prof. Sunil Das (IEEE Fellow, University of Ottawa, Canada)
Prof. Nikolaos D. Katopodes (University of Michigan, USA)
Prof. Biswa N. Datta (IEEE Fellow, Northern Illinois University, USA)
Prof. Mihai Putinar (University of California at Santa Barbara, USA)
Prof. Wlodzislaw Duch (Nicolaus Copernicus University, Poland)
Prof. Michael N. Katehakis (Rutgers, The State University of New Jersey, USA)
Prof. Dimitri Kazakos, Dean, (Texas Southern University, USA)
Prof. Ronald Yager (Iona College, USA)
Prof. Alexey L Sadovski (IEEE Fellow, Texas A&M University, USA)
Prof. Ryszard S. Choras (University of Technology and Life Sciences Bydgoszcz, Poland)
Prof. Remi Leandre (Universite de Bourgogne, Dijon, France)
Prof. Alexander Grebennikov (Autonomous University of Puebla, Mexico)
Prof. Guennadi A. Kouzaev (Norwegian University of Science and Technology, Norway)
Prof. Weilian Su (Naval Postgraduate School, USA)


Topics of Interest
--------------------------

Communications: 
--------------------------
Microwave Theory and techniques, CAD design for Microwave Systems, Antennas and Radars, Lightwave technology, Submillimeter-Wave techniques,
Microwave High-Power techniques, Microwave and millimeter-Wave Integrated Circuits, Microwave and millimeter-Wave Integrated Solid State Devices,
Microwave Acoustics, Filter and Passive Components, Microwave and Antennas Measurements, Microwave Superconductivity, RFIC's, Wave-guides, Microwave
propagation, Ferrites devices. Cavities. Microwave Circuits, Periodic Structures and Filters, Tubes, Masers, Amplifiers, HF-VHF-UHF Engineering,
Antennas, Reflectors and Lens Antennas, Arrays, Scattering, Propagation, Diffraction, Electromagnetic Compatibility Problems, Applied
Electromagnetics, Electromagnetic Field, Numerical Methods for Electromagnetics, Mathematical Methods and Computational techniues for Microwaves,
Mathematical Methods and Computational techniues for Antennas and Radars, Radio Engineering applications in Astronomy, Navigation, Aerospace Systems,
Low noise techniques, Optical Fiber Systems, Communication Electronics, Signal Processing for Wireless Communication., Communications Switching and
Routing, Physical Layer, ISDN, Computer Networks, Architectural Aspects, ATM Networks, Protocols, Network Architecture, Network Reliability, Narrow
band and Broad band Networks, Modern Routing Problems, Privacy and Security Problems, Queuing Theory and Communications, Traffic Problems, Wireless
and Mobile Computing, Communication Systems Integration, Cryptology, Military Communications, Internet, Programming Techniques in Communications
Networks, Simulation Techniques in Telecommunications, Software for Communications Development and Simulation, Social Implications of Modern
Communications, Soft Computing and Communications, Smart Interfaces, Computer/Communications Integration, Others ...

Signal Processing: 
--------------------------
Filter design and structures, Fast algorithms, Adaptive filters, Nonlinear Signals and Systems, Multirate filtering and filter banks, Signal
reconstruction, Time-frequency analysis, Spectral estimation, Higher order spectrum analysis, Parameter estimation, Detection, Array signal
processing, Statistical signal analysis, Signal and system modeling, Cyclostationary signal analysis, Speech production and perception, Speech
analysis, Speech synthesis, Speech coding, Speech recognition, Speech enhancement and noise reduction, Active noise control, Active noise reduction,
Echo cancellation, Psychoacoustics, Broadband audio coding, Signal processing for music, Binaural systems, Room acoustics, Digital transforms, HDTV,
Multidimensional systems, Machine vision, Image coding, Image motion / sequence / video, Computed imaging, Geophysical and seismic processing, Image
analysis and segmentation, Image filtering, restoration and enhancement, Image representation and modeling, Pattern recognition, Neural networks,
Fuzzy Systems, Evolutionary computation, Expert systems, Multisensor Data Fusion, Architectures and VLSI hardware, Programmable signal processors,
Algorithms and applications mappings, Design methology and CAD tools, Languages and real time software, Real time system estimation, Optimization
problems in signal processing, Radar, Sonar, Biomedical processing, Geophysical signal processing, Underwater signal processing, Remote sensing,
Robotics, Astronomy, Classification, Crime on the Web, Security. Publicity. Privacy. Reputation, Frauds in Business Reputation, Satellite signals
processing, Measure and Instrumentation. Others...


Computers: 
--------------------------
Computer Languages, Software Engineering, Data Structures, File Structures and Design, Data Bases, Compilers, Knowledge and Data Technology, Pattern
Analysis and Machine Intelligence, File Structures for on-line Systems, Operating Systems, Parallel and Distributed Systems, Information Systems,
Complexity Theory, Computing Theory, Numerical and Semi-Numerical Algorithms, Object-Oriented Programming, Parallel Programming, Computerised Signal
Processing, Computer Graphics, Computational Geometry, Machine Vision, Computer Elements, Computer Architecture, Computer Packaging, Fault Tolerance
Computing, Mass Storage Systems, Microprocessors and microcomputers, Multiple valued Logic, Numerical Analysis, Finite Element, Genetic Algorithms,
Game Theory, Operations Research, Optimization Techniques, Real Time Systems, Virtual Reality, Computer Algebra, Symbolic Computation, Simulation,
Pattern Analysis, Machine Intelligence, Adaptive and Learning Systems, Classification, Identification, Chaos Fractals and Bifurcations, Analysis and
design tools, Simulation, modelling, Emulation, Visualization, Digital Libraries, Hardware Engineering, Programming Techniques in Communications,
Networks, Management and Economic Systems, Multimedia, Video technologies, Simulation Techniques Tools, Computers in Armed Forces, Software for
Communications Development and Simulation, Social Implications of Modern Communications, Soft Computing and Communications, Smart Interfaces,
Intelligent Systems, Supercomputers and Supercomputing, Internet and Internet Computing, Intelligent Agents, Mobile Computing, E-commerce, Privacy
Problems, Hardware/Software Codesign,Cryptography, Computer/Communications Integration, Education, Others ...

 

 
Location and Conference Venue: http://tinyurl.com/cspc2014
---------------------------------
About Interlaken,          Map of Interlaken,          Photos From Interlaken,       Hotel (Conference Venue)
How to get to Interlaken,     Interlaken Travel Guide


 
Conference Publications
--------------------------
Accepted Papers are going to be published in

(a) Book, Hard-Copy Proceedings (will be sent to the following indexes: ISI, SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British
Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc)
(b) CD-ROM Proceedings (will be sent to the following indexes: ISI, SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO,
SWETS, EMBASE, CAS, Scholar Google etc)
Review Procees for Book and CD-ROM: Papers will undergo thorough peer review by 3 international experts. Reviewers have always proper academic
qualifications (recent publications in SCOPUS and ISI). You will receive comments from those 3 reviewers and your paper might be 
* a) accepted as it is (unaltered) 
* b) accepted after minor revision 
* c) accepted after major revision 
* d) rejected
We cannot guarantee acceptance for cases b) and c), if the reviewers are not satisfied by your response and your (minor or major) modifications to
your conference paper.


(c) After new peer thorough review of their extended versions in well-known and reputable international scientific journals 
(Indexed in SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc) and SPRINGER
VERLAG
Review Process for Extended Version in collaborating journals: Extended Versions of high-quality journals will undergo again thorough peer review by
3 international experts. You will receive comments from other reviewers and your extended paper might be 
* a) accepted as it is (unaltered) 
* b) accepted after minor revision 
* c) accepted after major revision 
* d) rejected
We cannot guarantee acceptance for cases b) and c), if the reviewers are not satisfied by your response and your (minor or major) modifications to
your extended paper.

(d) E-Library with free access




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